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Flip Chip Die Bonder at flip-chip-die-bonder.com

Flip Chip a Demanded Products

Datacon has always been committed to continuous research and development and ongoing product improvement. Right on track with industry demand, Datacon presents the quantum leap in flip chip production performance… the 8800 FC, the revolutionary platform setting new standards for dedicated, high volume flip chip production.
The 8800 FC dedicated flip chip platform offers a solution today to the flip chip market demands of tomorrow. To revolutionize a market, Datacon understands that it is necessary to invest in outstanding research and development – the result is a machine generation that combines: Remarkable performance up to 10,000 UPH; Exceptional accuracy 10?m@3s; High versatility Solder bump, ACP, NCP and more
With the new 8800 FC platform, Datacon raises the bar and offers you the optimum flip chip market solution.
Stay ahead of your competition – experience the superior technology of Datacon´s 8800 FC platform for yourself!

Flip Chip Wire Bonder by flip-chip-die-bonder.com

Flip Chip Die Bonder at flip-chip-die-bonder.com
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