Die Bonder Dispensing Solution We take immense pleasure in presenting to you - Datacon Flip Chip Die Bonder, the leader from the very beginning, offering you the ideal system for series production in this highly sophisticated technology. Our products are at very competitive prices. Through continuous product improvements and innovative research and development work, we have achieved a reputation as an international technological leader. Multiple international awards underline this claim.
Datacon has the reputation to consistently create innovative, dynamic, customer and market-specific strategies which lead to trendsetting product developments in the back-end assembly field of the Advanced Packaging Market. The Datacon North America, Inc. and Datacon Asia Pacific Pte. Ltd. subsidiaries handle marketing, sales and technical support in their respective regions as part of our Global network. Die Attach Dispensing Solution by die-attach-dispensing.com |
